Ion Beam Treatment Sputter system is designed for homogeneous coating of up to 350 mm substrates. The system is a versatile technique extensively used for the deposition of a wide range of materials such as insulators, metals, semiconductors. One or more magnetron cathodes of several sizes can be used in a system for deposition of multilayers of different materials or for co-deposition.
Linear anode ion source (attach the loadlock chamber) Uniformity : ≤ 3% (at 350mm zone) Base pressure : - Process Chamber ≤ 1 x 10-7 torr - Loadlock chamber ≤ 1 x 10-6 torr PEM (Plasma Monitoring System) : optional part Software interfaces : HMI programing base GUI software
Metal & oxide films deposition Thin-film transistors Reserch & development Simply ion beam cleaning